building new p4 system

[r0guenj]

<FONT face=Verdana>ok, building my next system and need to know (well verify anyway):

the p4 has a heat spreader on it. is it ok to still put as3 on it? the heat spreader has a small hole in one corner so if i do put on, i would have to be very careful.......

any help or insights out there???</FONT>

 

[Lord Evermore]

Just make sure you don't fill in the hole. The heatspreader does still need some sort of thermal interface material, just like a direct heatsink to core contact. If you get some in the hole, use a needle to carefully wipe it out, just make sure you don't jab the needle down onto the actual processor package underneath.

I'm not sure I really see the point of the hole anyway. It can't be for something like expansion of the air underneath the IHS due to the heat, since the heatsink seals the hole shut. Only thing I can see is that it's to let the air out while they're mounting the IHS to the package, which means after that, it doesn't matter much if you accidentally plug the hole, except you don't want thermal compound dripping down beneath the IHS.

 

[LouPoir]

Yeah - you want to put as on the HSF. Just dont fill in the hole.

Lou