- Mar 26, 2003
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I just got my 2.4C in from NEW EGG (BOXED not OEM) and I opened up the cardboard outer packaging and was looking at the chip (still heremtically sealed in the inside packaging may I remind you), and it appears to be scuffed up. Here's how I can explain it. Ya know when you put a heatsink on a CPU with Arctic Silver and then later on you take the heatsink off, the CPU kind of leaves a square outline where the CPU was pressed up agains the HS? Well, this looks like someone used a small heatsink and it left a small square like scuffmark approximately 2.5 mm in from all sides on the CPU die . It's not AS at all. It is just an outline scuff mark, very noticeable, even more so at the corners. I hope that the description is okay, I'm terrible at descriptive writing.
I was just wondering if anybody else has ever seen this? Could it be from INTEL testing the chip out before it sends it on it's merry way? Should I RMA it before I open it, or open it, test it, find out if it's a good overclocker, and if not, then RMA it?
I was just wondering if anybody else has ever seen this? Could it be from INTEL testing the chip out before it sends it on it's merry way? Should I RMA it before I open it, or open it, test it, find out if it's a good overclocker, and if not, then RMA it?
