Better Heat Transfer Heatsinks

[chewy0914]

Heats sinks are moving heat?
The heat travels across the material so so well?
I'm curious since the heat source can push the heat only so far.

Heat causing activity pushing the heat along?
Cooling fan creating low heat zone pulling the heat along.

I did try wrapping the exposed thermal pipe of a laptop heatsink with
electrical tape with at least the casing being cooler and I think
my temps being 10c lower.

Insulation With Cool/Cooling Zones.

Heat pipe insulated,
-----___c___c_____c--------cooling points?
fan/l------------------------------lcpu
----l------------------------------l
creating low heat zones to pull energy

-----___c+++__c++___c+----c+--c+++ cold to colder

multi fan/fan channels/other
fan--------------------------------------
fan2-----c--------c-------c---------c--

multi line same overall or larger size?
each insulated?

No interaction
Differing Combination Combinations of Interactions


Shapes in the line to effectively push
the heat-----

heat pipe
-------\-----\----\------
ooooo\ooo\oo\ooo
oooooooooooooo heat
ooooo/ooo/oo/oo
--------/-----/---/-----
bottle necks as heat passes through to force heat by activity
down the line creating a block making heat have an easier flow
route shape.material allowing peaks of heat transfer one way?

-------/-----/----/------
ooooo/ooo/oo/ooo
oooooooooooooo heat
ooooo\ooo\oo\oo
--------\-----\---\-----

l----loooooooooooooool-fan cooling pipe
l----lo------------------------l
lfanl-ooooooooooooolheat
l----l----o--------------------l
l----l---o---------------------l
l----loooooooooooooo-l-fan, same /other

Combination of heat going from one line to another in different patterns
heat going in direction sets inverse, together, other to push and pull heat?
Instead of even heat flow? near cooling point separate isolated line
going to another cooling point, or at any other locations.

multiline- thermally insulating heat sink fan contact points from each other.
-
-
-CPU Covering being made of Copper instead of current material?
copper layer in cpu over cpu part of cpu cover.

CPU to-heat sink /fan being one solid object.
In desktops/other with cover no thermal paste between cpu cover and heatsink.
Making cpu cover part of heatsink in laptop desktop/other

Thermal transfer ability of silicon?
Cpu having copper/other lines into cpu copper/other coating? top/bottom/sides?

If silicon transfers heat better silicon heatsink?
Silicon line/other in heatsink?

Hollow heatsink?
air being vacuumed very fast through heatsink?
Cooling line and maybe pulling heat?
Surrounded by air chamber pulling air,
with insulation on the outside?

Physically bind heatsink to cpu/gpu?
Top plate/copper/other
Take to store/other weld/de-weld
heatsink to plate.

Silver line through middle copper heat sink?

Diamond seems to be able to transfer heat well.
Is the technique available yet to shape man made
diamonds into heat sinks,channels,lines,other?
Take lines of diamond material,
put in copper/other heatsink?


Airplane Wing design----

silver/other
.......----
-----/----\-------

what does this do to light/other?


Heat build up?

.........................---- b---------------
......................./-----\-----------
........---- b---------------------
-----/----\-------

loop or don't

./
b--------0 ------------ =b----
.............\/...................\
........---- b---------------------
-----/----\-------

Or any direction

Copper other line? silver other at b point?










This is not making sense and people are complaining.

You need to stop with these kinds of technobabble threads.




esquared
Anandtech Forum Director

 

[DrMrLordX]

Let me get this straight . . . you wrapped some heatpipes in tape and it lowered your temps by 10C? That implies that the wicking action of the heatpipes was somehow impeded by heat loss from the pipes themselves.

When dealing with heat transfer through solids, there's no real loss of performance if you are leaking heat from whatever channel leads to the primary dissipative surface (fins or whatever). Sure, the fin temperature drops, so the total q for your fin array drops, but that doesn't matter because you more than make up for it by leaking heat elsewhere. No big whoop. With a heatpipe, well, maybe it's a little different.

The rest of what you are discussing (silver, diamonds, other things) have probably been examined and dismissed as impractical or too expensive for use in CPU cooling, particularly in a PC. And silicon does not transfer heat better that most heatsink materials. The k for silicon is 149 W/mK, while aluminum goes up as high as 190 W/mK, and copper can go as high as 401 W/mK.

Some people are looking at graphene or carbon nanotubes (or some derivative nanomaterial) for next-generation heatsinks. So far we haven't seen much market penetration for that stuff. If you think diamond is good . . .

 

[Blain]

Sounds like...

"This is a bunch of techno babble nonsense. Knock it off.
-ViRGE "

 

[Phynaz]

Tweakboy, is that you?