The method that works best seems to depend on the
thickness and viscosity of the thermal paste.
For example, Intel's stock TIM can be too thick,
which in turn can interfere with the push-pin fasteners.
I recently upgraded 2 workstations, and
I had a chance to compare some older Antec paste
with a new Antec silver compound.
The older white-colored paste was very easy
to spread into a very thin layer. Then, I did
the very same thing with the heatsink,
trying to make that layer as thin as possible too.
The newer silver compound was much heavier
and it was more difficult to apply a layer that
was as thin, so I only applied it to the CPU
and not to the HSF.
It's very easy to apply too much: the only
real function that thermal paste performs
is to fill in the barely visible pits and grooves
in both surfaces which make perfect contact
impossible.
So, flatness and smoothness are two factors
that influence how much paste is really needed:
the rougher those 2 surfaces, then more paste is needed,
and the flatter those 2 surfaces are, then less paste is needed.
And, when in doubt, reading the directions is a good
place to start: just be sure to check your temps,
either at the BIOS "hardware" tab, and/or
with software that comes with your motherboard.
With our ASUS motherboards, the latter is called "PC Probe".
This temp check is very important, because improper
seating will cause over-heating, and whatever
thermal paste you apply will not necessarily mitigate
improper HSF seating.
Sincerely yours,
/s/ Paul Andrew Mitchell, Inventor and
Webmaster, Supreme Law Library
All Rights Reserved without Prejudice