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Basic HSF /cpu build question - help!

dougjnn

Senior member
I assume I'm supposed to leave the 4 rubber "feet" that came on my T-Bird 1200 (which I just received a few minutes ago) on the processor, right? Without any pressure they create an air gap between the TBird core and my Taisol HSF, but it looks like if I apply pressure (as the clips will do), that the rubber feet will compress. Have I got this right? (Don't want to fry my shinny new BLUISH purple core TBird!!!)

Also, I'm best off scrapping the sticky gunk that came on the bottom of my Taisol off, right, and instead applying a couple of drops of thermal paste (I got the Chemtronics stuff) to the core and finger smearing it???

Finally, as I understand it, all the Tbird 1200's come unlocked, right? So I don't need to do the pencil (or rear window defogger) trick first, correct?

I've got one of the NEW BXHA chips!!! Yippee! Assembled in Malaysia. Is that good or bad? Looks like it is either week 103 or it was made in the third week of '01 -- not sure how to read that.

 
i'm not an AMD user, but the only advice i give is to k\not spread the thermal paste with your finger, use a clean knife edge or letter opener or something... the oils off your finger can contaminate and casue slight performance decrease in the grease...
 
The rubber feet don't do too much, and they are supposed to compress. Actually, the more pressure you put between the hs and the chip, the cooler it will run (make sure it's flat though)
 
DO NOT remove the rubber feet. They are there to ensure that only a small portion of the underside of the heatsink comes in contact with the CPU core. When applying the thermal compound, cover your finger with a plastic bag and spread it, achieving a nice, thin, even coating.
 
Thanks bolomite, alpineranger, and Supradude, I feel I can build now!

Overclocking ambitions!

Will let you all know.
 
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