AS5 vs Céramique

[ToxicWaste]

Damn, I figure a 2.7g syringe of Ceramique is gonna last me a couple dozen machines. I just setup my XP 3000+ with it. Before that, I just uses the stuff that came with the heat sink... Never really had a problem with it... ...just liked the idea of non-conductive thermal compound. Hence Ceramique.

Do all you people buy a new batch of thermal compound every time you setup a new machine? Or do you just pull your heat sink off your cpu alot for some reason and use it up fast? What do you do with the left over old thermal compound?

Awe, it's probably just the never ending quest to use the latest/best and drop the ol' CPU another fraction of a degree.

 

[Goatsan]

for the record, AS5 doesn't conduct electricity. and i only buy more thermal paste when i am out of it. i tend to use a decent amount of my neverending quest to get the quietest cpu. changing out heat blocks left and right.

 

[ToxicWaste]

No, but it is slightly capacitive, so still be careful about spreading it around... But, it does look like very good stuff.

 

[beatle]

Originally posted by: Salvador

I use Ceramique and it is more difficult to spread than AS3. I can't imagine what AS5 is like, since Ceramique already seems (crispity, crunchity) "peanut-buttery" in comparison to AS3.

I certainly hope that you didn't apply the Ceramique the same way as the other AS products. You're not supposed to spread the Ceramique out. You're just supposed to put a small amount in the middle and then twist the hs on it.

I too am looking for a comparison and guess I'm going to have to find out for myself. I used Ceramique on my last build and I'm about to use AS5 on this one. I can't tell if Ceramique is any better than the AS3 that I used previously. The AS3 wasn't hard to spread, but the Ceramique was a little difficult to install even though I didn't have to spread it. The consistency is weird and it's hard to put just the right amount on the core.

Anyway..

Sal

You're still supposed to spread it on the heatsink, which is a bit more challenging (though not exactly difficult). I have a P4 so the application is the same for all compounds.

 

[screw3d]

I've read in some review that it actually works better if you use the pressure of the heatsink to spread AS5 because you won't introduce tiny air bubbles that spreading manually does. This is actually suggested by Nevin, AS's owner.