That's the whole point of good HSF to CPU contact - a flat HSF and flat cpu mated with a strong spring will leave almost no air gaps. The AS or any other thermal compound will fill the gaps and conduct heat better than an air gap, better even than a metal-to-cpu interface.
Removing the HSF should reveal a minimum of compound if you have a good installation. The AS is only a heat conductor, not a heat sink, and ensures rapid heat tranfer from CPU to HSF. It also fills any air gaps between them, since air is NOT a good heat conductor in this application.
If you got good temps, (yes, I know it's innacurate), no heat related crashes, you're OK. If you see little compound on removal, evenly spread on the CPU, it's a good installation.