System in signature is being put together right now...
Got it to post last night and was monitoring the temperatures. After 2 hours of "running" (idle I guess as only the bios was on the screen...), the CPU temp was stabilized at 39 C which I thought was a bit high considering no overclocking and the cooling ability of the PAL 8045...
I've heard alot about the temperature sensing capabilities of the new motherboards and how they DON'T necessarily give an accurate representation of what the "real" temp is (something about not using the diode AMD designed for the purpose or something along those lines...)
My question is this: My disappontment is due to the fact that the 39C seems average to "not too good" based on other posts with similar CPU/fan combos but perhaps I'm comparing Apples to Oranges... I
i suppose only those with an Epox board similar to mine will be able to indicate the relative succes of my HSF to get heat from the CPU. Anyone have results with this particular board to compare notes?
I know the ASII technical data says that it can take 3 days or so to "break in" the compound and that temps will drop an average of 2-4C after that time. That should help, but I still want to know how I'm faring at this point...
Got it to post last night and was monitoring the temperatures. After 2 hours of "running" (idle I guess as only the bios was on the screen...), the CPU temp was stabilized at 39 C which I thought was a bit high considering no overclocking and the cooling ability of the PAL 8045...
I've heard alot about the temperature sensing capabilities of the new motherboards and how they DON'T necessarily give an accurate representation of what the "real" temp is (something about not using the diode AMD designed for the purpose or something along those lines...)
My question is this: My disappontment is due to the fact that the 39C seems average to "not too good" based on other posts with similar CPU/fan combos but perhaps I'm comparing Apples to Oranges... I
i suppose only those with an Epox board similar to mine will be able to indicate the relative succes of my HSF to get heat from the CPU. Anyone have results with this particular board to compare notes?
I know the ASII technical data says that it can take 3 days or so to "break in" the compound and that temps will drop an average of 2-4C after that time. That should help, but I still want to know how I'm faring at this point...