Any new word on BBUL packaging?

[MadRat]

I'm excited about the technology but its not been put to the test yet! It will give us a huge cooling surface in tomorrow's CPU's rather than these tiny surfaces of today's chips. The cooling surface of the core will theoretically include the sides of the core! BBUL will probably be better technology than Intel's heatspreader because the entire surface of the CPU's packaging will be flat and in contact with the heatsink, allowing 3-dimensional flow of heat through the CPU packaging. Thermal shields on today's P4's still only allow a 2-dimensional spread of the heat because they only make contact with the top of the core. BBUL will allow the heat to spread from all directions of the core thereby allowing heat to come from above and around the core. It should make a world of a difference in cooling the CPU's.

 

[MadRat]

<bump!>

I'm surprised nothing uses this technology yet!

Its so simple yet will give manufacturers headroom for cooling and protection from compression.