I'm trying to determine how best to address this. I recently upgraded several components in my system, one of them being the HSF to a Sunbeam Core Contact Freezer. It definitely is doing its job, however now that I have my system completely updated it's time to put the side panel on. In doing so, my CPU temps go up by about 6C, not that it was unexpected that it went up, but by that much.
Obviously it's an air flow issue. Being that there are no intakes in the case that high up, I'm fairly certain it's a case of the heatsink having to take in stagnant case air.
Now my question is on the P180, I have both the top and the rear fans blowing out of the case. I'm wondering if I should even bother trying to flip the top fan around to suck air into the case instead. It sits about half way into the body of the heatsink itself, so it may help some, but at the same rate it sits behind the heatsink's fan, so I would guess that it may not help the issue any either.
Opinions? I'd like to recoup at least some of the benefit of the temps the CCF can achieve.
Obviously it's an air flow issue. Being that there are no intakes in the case that high up, I'm fairly certain it's a case of the heatsink having to take in stagnant case air.
Now my question is on the P180, I have both the top and the rear fans blowing out of the case. I'm wondering if I should even bother trying to flip the top fan around to suck air into the case instead. It sits about half way into the body of the heatsink itself, so it may help some, but at the same rate it sits behind the heatsink's fan, so I would guess that it may not help the issue any either.
Opinions? I'd like to recoup at least some of the benefit of the temps the CCF can achieve.
