Go here. Enjoy:
Tomorrow's CPUs will be much more complex thus requiring more advanced silicon-substrate interconnect technologies; die sizes will continue to decrease as this happens, creating new routing issues; while all of this is happening CPU clock speeds will increase which requires that even more care be used when designing the entire package.
As clock speeds continue to ramp you can expect to see CPU manufacturers implement advancements in packaging technology. The most recent example of this would be AMD's upcoming Athlon XP CPU which will be AMD's first organic based substrate ever. While Intel has been using organic based substrates for the past few years, AMD has been stuck using ceramic packages for the longest time. The move to an organic based substrate was necessary to allow AMD to ramp to higher clock speeds with their Athlon line of processors.
And a little bit of what we can look forward to in the future:
Although not nearly as high, FSB frequencies are also ramping up as clock frequencies do. Intel's Northwood (0.13-micron Pentium 4) core will eventually use a 400MHz FSB, Intel's Prescott core will use a 800MHz FSB, and their Tejas core will use an incredible 1.2GHz FSB upon its release.
AMD isn't sitting still either; their Hammer line of processors is rumored to have an 800MHz FSB as well. It wouldn't be too shocking if part of the reason for introducing an organic based substrate was to get all of the kinks worked out for a debut on their Hammer processors...The benefits of this type of packaging can also be extended to multi-core CPUs. One of the major problems with outfitting a CPU with two cores is that the two must be tested together in the final CPU and if just one is bad, the entire CPU must be thrown away (AMD's SledgeHammer will unfortunately face this problem it seems).
Ah yes, me want. 😀😀😀
Tomorrow's CPUs will be much more complex thus requiring more advanced silicon-substrate interconnect technologies; die sizes will continue to decrease as this happens, creating new routing issues; while all of this is happening CPU clock speeds will increase which requires that even more care be used when designing the entire package.
As clock speeds continue to ramp you can expect to see CPU manufacturers implement advancements in packaging technology. The most recent example of this would be AMD's upcoming Athlon XP CPU which will be AMD's first organic based substrate ever. While Intel has been using organic based substrates for the past few years, AMD has been stuck using ceramic packages for the longest time. The move to an organic based substrate was necessary to allow AMD to ramp to higher clock speeds with their Athlon line of processors.
And a little bit of what we can look forward to in the future:
Although not nearly as high, FSB frequencies are also ramping up as clock frequencies do. Intel's Northwood (0.13-micron Pentium 4) core will eventually use a 400MHz FSB, Intel's Prescott core will use a 800MHz FSB, and their Tejas core will use an incredible 1.2GHz FSB upon its release.
AMD isn't sitting still either; their Hammer line of processors is rumored to have an 800MHz FSB as well. It wouldn't be too shocking if part of the reason for introducing an organic based substrate was to get all of the kinks worked out for a debut on their Hammer processors...The benefits of this type of packaging can also be extended to multi-core CPUs. One of the major problems with outfitting a CPU with two cores is that the two must be tested together in the final CPU and if just one is bad, the entire CPU must be thrown away (AMD's SledgeHammer will unfortunately face this problem it seems).
Ah yes, me want. 😀😀😀
