ASFAIK the SOIC bonding process takes place at TSMC, just like producing the chiplets. I can't see them allowing off site anytime soon. Critical tech for competing against other fabs.Do we know whether AMD plans to do SOIC packaging on its own like it does with substrate packaging? If not I expect it to cost more in any case just for the reason AMD can't move it in-house and directly profit of economy of scale. I haven't seen any news indicating the TF AMD packaging plant in Malaysia, the current or the upcoming one in next year, is capable of SOIC or not.
If anything, as more TSMC customers begin using SOIC, the volumes will be greater than AMD alone can generate.