There are some 'new' fake or not renders of AM5 here.
https://t.co/84T6wUjpQ2
For the sake of argument let's assume this is how it will look.
Is it possible that they increased the height of the IHS so they would have more freedom to stack with different heights below it?
Yes you IHS would need to have some 'levels' cut out (less than 0.5mm) but it may be easier than trying to get it all different dies on the same height.
Not sure where this would come into play but I guess if you have 3 different dies this may be a better idea.
Maybe when they add a (variable) HBM3 height it's much easier to have another set of IHS than having to add extra layer on the other dies to match it.
Maybe it's only thicker because they increased the TDP
https://t.co/84T6wUjpQ2
For the sake of argument let's assume this is how it will look.
Is it possible that they increased the height of the IHS so they would have more freedom to stack with different heights below it?
Yes you IHS would need to have some 'levels' cut out (less than 0.5mm) but it may be easier than trying to get it all different dies on the same height.
Not sure where this would come into play but I guess if you have 3 different dies this may be a better idea.
Maybe when they add a (variable) HBM3 height it's much easier to have another set of IHS than having to add extra layer on the other dies to match it.
Maybe it's only thicker because they increased the TDP