Advice needed from Nanotherm PCM+ owners

[F1]

I just bought some Nanotherm PCM+. Im a thermal compound noobie. I just tryed appling some to my new cpu and SLK900U. I following the AS3 website instructions. I applied a drop of Nanotherm PCM+ then rubbed it around the surface with my finger inside a plastic bag. Then i attempted to smooth it out with a plastic card, but all i seemed to accomplish here was wipping it all off and leaving hardly any left on the surface.

Ok, i just cleaned the surfaces up again and now im going to start again from scratch. People tell me the best way step by step on how to accomplish the best results, starting with how much Nanotherm PCM+ to use. I want to get this baby built and purring .

Thanks Guys.

 

[Chumpman]

Suggested Instructions for Applying Nanotherm:

* Observe proper Electrical and ESD safety precautions.
* Remove Heat Sink and Fan assembly (or other cooling device), if already attached.
* Remove most of the thermal compound from the processor core and HSF with a dry, lint-free cloth (i.e. - coffee filter). If the HSF has pre-integrated PCM or thermal pad, skim it off with a sharp razor blade being careful not to scrape the contact surface - or yourself.
* Lapping the HSF to a mirror-like finish with an extremely fine grit "wet or dry" sand paper or diamond compound is an option and should only be attempted by those with advanced technical knowledge and experience.
* Degrease the CPU core and HSF with a coffee filter dampened with lighter fluid and wipe dry.
* Clean the surface of the die and the bottom surface of HSF with isopropyl (rubbing) alchohol (70% or higher) and wipe dry.
* Place a small bead of Nanotherm on the processor core and spread around the top surface in a circular motion. It's OK to use your finger. Make sure to spread a thin, even and uniformly opaque coating across the entire surface of the die.
* Repeat the same for the bottom surface of the HSF - make a "circle" of compound only slightly larger than the size of the CPU core. Be sure the compound on the HSF is properly positioned to 'mate' with the CPU core when assembled.
* Smooth/ remove excess material from both application surfaces with a credit card (or something else that has a thin flat edge that won't scratch either surface) with very light pressure. Both surfaces should have a relatively smooth, even and opaque coverage of compound.
* Place the HSF flat on top of processor and assemble with only the force necessary to engage the clip mechanism.
* Connect power to the HSF, reinstall internal components, remove any tools, button up the case, reconnect the power cord, power up and verify normal operation

 

[F1]

Thanks, saw that before.