Ack, applying arcticsilver II right now, and instruction page is down!!

rondeemc

Golden Member
Jan 6, 2001
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Here you go....

Arctic Silver
Premium Silver Thermal Compound

Important Precautions
Don't eat it.
Don't squirt it in your eye, nose, ear, or any other accessible body orifice.

Don't give it to children or leave it laying around where kids can get a hold of it.

Don't smoke it.

Clean it off your skin with isopropyl (rubbing) alcohol.





Caution:

While much safer than silver greases engineered for high electrical conductivity, Arctic Silver should be keep away from electrical traces, pins, and leads. The compound is slightly capacitive and could potentially cause problems if it bridged two close-proximity electrical paths.



Application Instructions

1. Even though Arctic Silver is specifically engineered for high electrical resistance, you should keep the compound away from processor, memory, and motherboard traces and pins. There is a possibility that dust or metal particles and/or shavings carried by the airflow inside the computer case could contaminate the compound and increase its electrical conductivity.


2. ONLY Arctic Silver should be between the processor core and the heatsink.
Remove any thermal pads or other interface material from the heatsink before applying the Arctic Silver.


3. Clean the mating surfaces completely with a low residual solvent (isopropyl alcohol will work) and a LINT FREE cloth. (i.e. lens cleaning cloth) If the heatsink surface has had thermal compound previously applied, the surface should be thoroughly scrubbed and cleaned with a quality degreaser (Available at automotive stores.) and then followed with the alcohol cleaning step. It is important to keep the surfaces free of foreign materials and NOT to touch the surfaces (a hair, piece of lint, and even dead skin cells can significantly affect the thermal interfaces performance, especially on modern small core CPUs as the surface area is already severely limited). In addition, oils from your fingers can adversely affect the performance by preventing the micronized silver fill from directly contacting the metal surface. (Finger prints can be as thick as 0.005")


4. Cup the syringe in the palm of your hand with the barrel between your middle and index finger as shown in the photo to the right. Slowly squeeze your hand shut and maintain a constant gentle pressure on the plunger until the compound begins to come out of the nozzle.
Only use gentle pressure and be patient. Do not press hard trying to get the compound to come out faster.
Only apply the thermal compound to the top of the actual CPU core. (Also known as the slug or die.) In the photo to the right it is the small raised blue rectangle in the middle of the Celeron II processor. On an AMD Duron or T-bird, it is the small raised rectangle in the center of the AMD processor.

The flatter the mating surfaces, the thinner the layer that is required. Stock processors and/or heatsinks with normal surface irregularities will require a layer 0.003" to 0.008 thick as shown below to fill the resultant gaps. (Equal to the thickness of 1 to 2 sheets of standard weight paper.) Properly lapped processors and heatsinks with mirror finishes will only require a translucent haze.
Start with a small amount, about 1/2 the size of a BB or less, and spread it over the core as shown in the photos below.





DO NOT use your finger to apply or smooth the compound (skin cells, and oils again). A razor blade or the clean edge of a credit card can be used as the application tool. You may use whatever tool you choose as long as it is CLEAN and allows you to control the application area and thickness.


5. RECHECK to make sure no foreign contaminants are present on either surface, and assemble the two surfaces.


6. PRESS the two surfaces together ONLY. Minimize any "twisting" or lateral "sliding" in either plane in an attempt to mate the "peaks" of the surfaces together. When you twist or slide one surface against the other, "peaks" on one or both surfaces will travel over areas where two "valleys" should come to rest. The peaks will scrape away compound that is needed to fill the void between the valleys that will oppose each other when the surfaces are in their final position and cause small voids (air gaps). ANY air gap will significantly increase thermal resistance in an otherwise GOOD interface. If the thermal compound is properly made and of the proper consistency, direct non-sliding pressure vertical to the mating plane will be more than enough to insure that the surfaces "bottom out". Additionally, "sliding" the surfaces together may cause one surface to scratch/gouge the other possibly opening up a larger inter-surface gap which will increase thermal resistance.


7. Secure the thermal interface with the supplied clips or other hardware.


Arctic Silver is a trademark of Arctic Silver LLC 2000, 2001.
All information on this page is copyright 2001, Arctic Silver LLC.


This page is definitely under construction!
 

SuperKen!

Senior member
Jan 16, 2000
533
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T-bird 850 OC'd to 1Ghz (133 x 7.5) at 1.92v's

:)

Interesting enough this is the exact same temp I had with the Taisol with the stock thermal compound. Then I scratched that stuff off, and used somethign else, which raised it 4-5C, and now after applying ACII its back down again.

So.....I would say that the stock thermal material found on Taisol HSF and EXCELLENT.
 

SuperKen!

Senior member
Jan 16, 2000
533
0
0
Actually, let me correct myself.

With ACII my CPU is running 3C lower than with the stock Taisol themal material. When I took the stock Taisol Thermal material off (and put some FRY's thermal material), it went up 3C.

So, I should say the stock Taisol thermal material is very good, but the ACII is even better.
=)
 

rondeemc

Golden Member
Jan 6, 2001
1,216
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Thanks for the info. I am going to try and run my locked 800 8x133 for 1064 tomorrow using artic silver and the pal6035 in a Fong Kai 302 with the CPU shroud. Nice to know 1ghz is working out well.

Take care.
 

SuperKen!

Senior member
Jan 16, 2000
533
0
0
What kinda locked CPU you have?

If its an AMD, why dont you just go with the silly (but SO cool) pencil trick?

If not, good luck OC'ing your chip.
 

rondeemc

Golden Member
Jan 6, 2001
1,216
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AMD. I have an AbitKT7A and the socket is very close to a support in the case. The HSF is a problem to remove once installed. I did the pencil trick before I installed the HSF but I must have an open circuit because it doesnt work and I don't want to chance removing it to redo at least until the prices come down somemore just in case I chip it.