Maybe they will take advantage of both sides of mainboards in future form factors. Seems like we are reaching the point where heat is pooling at the PCB. Could be interesting to see soldered in memory underneath the core and on the backside of the mainboard, to provide minimal trace lengths. CAMM to provide expansion memory on the topside of the mainboard, to provide minimal trace lengths there, too. Paired DDR5 memory channels could run to the CAMM, and the mainboard manufacturer can run memory channels under a flexible architecture to maintain sensitivity to market segmentation. A cheaper manufacture could forgo either the CAMM module or soldered in RAM altogether, offering just enough base memory with support for reduced memory channels under either architecture to run a system. (Maybe a POS equipment manufacturer finds one 32-bit memory channel desirable.) A mid-tier manufacturer may run four 32-bit channels to the CAMM module. Another mid-tier could run both, but go for two 32 bit DDR channels to each to keep it cheap. Another mid-tier may offer three 32 bit DDR channels to the soldered in memory, but only support a single 32 bit DDR channel for the CAMM module. Or they may just run conventional DDR5 through the four channels. Flexibility would be the key.