In short, 3D XPoint is essentially a DIMM slot SSD that performs at DDR4 speed. So fast that there is no need for actual RAM in a system and it doesn't wear out like flash ram.
some features:
same read write speeds
non-volatile (can store data when powered off)
cheaper than DRAM, more expensive than flash
The first generation of what Intel is branding "Optane" will be available via SATA, SATA Express, PCIe due in 2016. While the second generation will likely be launched with Cannonlake in 2017 for the Xeon.
HBM is not located where GDDR5 would be, it is actually located on the package where you would have a GPU/CPU but separated by an interposer. HBM can also be stacked vertically to allow for a theoretical 4 times the memory per chip. HBM is stacked by using tiny holes in the silicon called TSVs.
some features;
one gigabyte of HBM is smaller than one gigabyte of GDDR5
HBM is more power efficient allowing more power-hungry GPU/CPUs
HBM has a large bandwidth
The first generation of HBM is already available however its based on 28nm manufacturing process so it is not until the 2nd generation in 2016 we will see significant performance gains when the process switches to 14nm. Furthermore, it is likely AMD will use HBM with their APU line instead of DDR4.
some features:
same read write speeds
non-volatile (can store data when powered off)
cheaper than DRAM, more expensive than flash
The first generation of what Intel is branding "Optane" will be available via SATA, SATA Express, PCIe due in 2016. While the second generation will likely be launched with Cannonlake in 2017 for the Xeon.
HBM is not located where GDDR5 would be, it is actually located on the package where you would have a GPU/CPU but separated by an interposer. HBM can also be stacked vertically to allow for a theoretical 4 times the memory per chip. HBM is stacked by using tiny holes in the silicon called TSVs.
some features;
one gigabyte of HBM is smaller than one gigabyte of GDDR5
HBM is more power efficient allowing more power-hungry GPU/CPUs
HBM has a large bandwidth
The first generation of HBM is already available however its based on 28nm manufacturing process so it is not until the 2nd generation in 2016 we will see significant performance gains when the process switches to 14nm. Furthermore, it is likely AMD will use HBM with their APU line instead of DDR4.