3770K De-lidded and lapped With Liquid Pro - Awesome results.

[Stu @ MSD]

Hi Guys,
Took the plunge and de-lidded my 3770K as even with my huge loop, 90c at 1.28v and 4.7ghz was stopping me testing any further and I really want some more clocks. Also, my core temps were very uneven which has always niggled me.
Plus - I just wanted to do it for the hell of it, so off we go...
Quick test beforehand using ten runs of IBT on normal yield the following results.

• 
  
• Idle Core 1 = 31c
  
• Idle Core 2 = 26c
  
• Idle Core 3 = 29c
  
• Idle Core 4 = 23c

• 
  
• Max Core 1 = 76c
  
• Max Core 2 = 88c
  
• Max Core 3 = 83c
  
• Max Core 4 = 79c

After the work was completed, I performed the same test, and yielded the following results.

• 
  
• Idle Core 1 = 27c (-4c)
  
• Idle Core 2 = 24c (-2c)
  
• Idle Core 3 = 26c (-3c)
  
• Idle Core 4 = 22c (-1c)

• 
  
• Max Core 1 = 53c (-23c)
  
• Max Core 2 = 56c (-32c)
  
• Max Core 3 = 58c (-25c)
  
• Max Core 4 = 54c (-25c)

An incredible max improvement of 32 Degrees C!
And importantly, the cores are now all within 5c of each other, instead of 12c as they were previous, which I expect is a result of the lapping.

Just to be sure it wasnt a fluke, I put ona quick double run on Max settings. results are almost identical.

Pleased?
Oh yes! Now for some more volts and clocks!

Pictures to follow. just uploading.

 

[Stu @ MSD]

The bits n bobs...


She's under the knife...


No turning back now...


http://www.stewartsanderson.com/p511390059/e540e170a

IHS was definately concave... that pleased me.






Pop her back in with some Liquid pro...




And that is pretty much that. All I can say is TAKE YOUR TIME.

Rush this and you will slip and wreck her... but take your time and its very simple to do.

 

[thilanliyan]

Wow that's a HUGE temp decrease!

Why not go direct to die?

 

[KingFatty]

Any details how you re-assembled it? Did you scrape off all the glue so that there was a little gap around the edge, or did you leave the glue there?

 

[dqniel]

I saw similar results using Liquid Ultra on my 3570k. Too bad that so much effort was required for us to get reasonable temps out of these chips when Intel could have just soldered them in the first place.

 

[Idontcare]

Excellent results Stu :thumbsup: Amazing drop in temperature!

 

[Ferzerp]

I have some on the way. I decided not to try to use my IX under there somehow.

 

[LagunaX]

Excellent!
My 4.8ghz 3770k is scheduled for surgery as soon as my Liquid Pro arrives from Frozencpu!

 

[ShintaiDK]

Wow amazing results. And damn thats a bad concave!

 

[oceanside]

Awesome temps! I'm holding out hope that Intel goes back to solder with Haswell so I don't have to do this.

 

[Puppies04]

Very nicely done, those results are absolutely superb. Now lets see some 5ghz runs .

 

[tweakboy]

That is freakin awesome 30c less on full load wow. Amazing results.

 

[Nemesis 1]

I saw similar results using Liquid Ultra on my 3570k. Too bad that so much effort was required for us to get reasonable temps out of these chips when Intel could have just soldered them in the first place.

True thats what intel could have done . I glad they didn't . For enthusiast who like to get their hands dirty this is the best. I mod my lids and go direct die. I use the lid only to stop rocking on the die . I hope Haswell is the same way.

 

[MadScientist]

So the Liquid Pro is the only thing keeping the IHS on????

Ok, the product description answers my question.

"Cool Laboratory Liquid PRO consists of 100% liquid metal - the metal remains liquid at ambient temperature. The Liquid PRO paste has a heat transfer rate over nine times that of conventional thermal compounds!
Liquid PRO does not contain any non-metallic additives such as silicone. Due to this composition it out performs the best thermal compounds on the market by a factor 9.

The liquid metal behaves similar to mercury. Application of the thermal compound should be done with a small, lint-free brush to distribute the compound evenly across processor or heat sink. After installation the Liquid PRO will mature in 48 hours. It solidifies at that time and achieves its optimal cooling performance."

 

[Ferzerp]

So the Liquid Pro is the only thing keeping the IHS on????

The adhesion of a TIM to the die (and frankly the air pressure once you squeeze it together (maybe)) and the IHS is plenty. I haven't seen anyone report affixing the IHS in any way once they've cut it off. I know I certainly don't.

You have to make sure when you clamp the socket down that you don't let it slide out of place, but after that, it's not like it's going anywhere, the socket clamping force is plenty, and the when its out, it's stuck on well enough to be fine.

Adhesive is just another way to ruin your contact by making things raised, and probably less level.

 

[dqniel]

The adhesion of a TIM to the die (and frankly the air pressure once you squeeze it together (maybe)) and the IHS is plenty. I haven't seen anyone report affixing the IHS in any way once they've cut it off. I know I certainly don't.

You have to make sure when you clamp the socket down that you don't let it slide out of place, but after that, it's not like it's going anywhere, the socket clamping force is plenty, and the when its out, it's stuck on well enough to be fine.

Adhesive is just another way to ruin your contact by making things raised, and probably less level.

I used a thin bead of RTV silicone adhesive. I didn't want to worry about the IHS coming off when removing the CPU from my motherboard, since the sliding action of the retention clip can move the IHS while the rest of the CPU remains stationary in the socket.

True thats what intel could have done . I glad they didn't . For enthusiast who like to get their hands dirty this is the best. I mod my lids and go direct die. I use the lid only to stop rocking on the die . I hope Haswell is the same way.

I've heard Haswell will be soldered, but it was just hearsay at the time. I don't know if any official statement/info has been made/leaked yet.

 

[SomeoneSimple]

After installation the Liquid PRO will mature in 48 hours. It solidifies at that time and achieves its optimal cooling performance."

Really, do mind the bold part.

I'm just throwing this out here:
I completely screwed up my GPU-temps because of this feature, so a tip; don't use Liquid Pro or similar TIM's on a silicon-die if the attached heatsink is wobbly (like universal waterblocks with only 2 pins) and might move slightly (like strain from WC tubing).

Temps on my 670 went through the roof (from ~45'c at load to 80'c while the 670 was throttling like crazy) because the TIM, in the die's shape, was hardened onto the heatsink, and the heatsink was twisted a little (because I moved my PC), basically nullifying the contact area.

So handle Liquid Pro and similar TIM's with care, as it won't attach to the die, and might get misaligned if you messed around with it, after the TIM has solidified.

For a heatsink this isn't much of a problem (I still haven't lapped my block though, I've put some other TIM onto the hardened liquid TIM for the time being. Disassembling a custom loop is such a pain :|) but if you mess up the inside of the CPU heat-spreader the same way I did with my waterblock, I bet you'll be in much bigger trouble.


But anyway, I really hope Haswell will be soldered. It's kind of ridiculous that we have to remove the heat-spreader and redo the TIM, to get decent temps with high-end cooling.

 

[LagunaX]

You got any more testing results say at 4.8-5.0ghz now that your temps are reasonable?

I'm probably gonna reseal the IHS with Alumina after the Liquid Pro.

 

[tw33k]

Has anyone actually verified that Liquid Pro "soldifies" after 48 hours? I've only had it on my chip a few hours at a time while comparing it to Liquid Ultra. After my next lot of tests I'll leave Pro on and see for myself

 

[LagunaX]

Thought I killed my chip for a sec after surgery as I used an X-Acto knife and I did score some of the green pcb to expose some yellow metal -eek! 1 edge razor blade is probably the safest as you can't torque the blade to cut into the pcb.

Liquid Pro on the inside, MX-4 on the outside, IHS resealed with AS Alumina bonding material.

Would not boot for the first 5 min. Swapped out another 3770k I bought just in case I borked the surgery. Booted up, then off, then swapped back.

Was able to reboot thank goodness no major damage done - maybe time was needed for the Liquid Pro?

Anyways wil test later tonight when it gets cooler here in Southern California but briefly it looks like a 19c drop after a 20 min run.

 

[SomeoneSimple]

Has anyone actually verified that Liquid Pro "soldifies" after 48 hours? I've only had it on my chip a few hours at a time while comparing it to Liquid Ultra. After my next lot of tests I'll leave Pro on and see for myself

I can confirm it solidifies, I can't say how long that takes though.

This is what my gpu-block looks like from the bottom, the die-sized gray patch is the solidified TMU, which is hard as rock, and will require sanding to get rid of.

 

[MadScientist]

FYI. Liquid Pro's MSDS: http://www.coollaboratory.com/pdf/safetydatasheet_liquid_pro_englisch.pdf

I've never seen an MSDS, and I've seen a lot of them, quite like this one. It's a bit comical.
For example:
Section 11.2 Effects at Humans
After swallowing: Leaves the body on natural way.

 

[LagunaX]

My 3700k survived the delidding surgery despite my scoring of the PCB with my X-Acto knife and exposing some yellow metal.
Die Liquid Pro, IHS MX-4, resealed with Alumina thermal bonding compound.

Highest difference 21c drop, lowest difference 15c drop, after 1 hour of Prime95.

Before:
http://i246.photobucket.com/albums/gg84/jhchang69/3770k48ghz3231B415_zpsdc9d043f.jpg

After:
http://i246.photobucket.com/albums/gg84/jhchang69/Delidded3770k_zps393f2f66.jpg

Not afraid of the big bad wolf anymore ...I would have never run IBT before with a highly overclocked 3770k on air cooling!
http://i246.photobucket.com/albums/gg84/jhchang69/IBTDelidded3770k_zps547b885a.jpg

Not even 70c on mid-high range air on a 4.8ghz 3770k on max settings!

 

[dqniel]

Has anyone actually verified that Liquid Pro "soldifies" after 48 hours? I've only had it on my chip a few hours at a time while comparing it to Liquid Ultra. After my next lot of tests I'll leave Pro on and see for myself

My Liquid Ultra completely solidified. Not sure of the amount of time it took, but it solidified in a copper-on-copper (lapped HSF and lapped IHS) situation. I had to re-lap my IHS and HSF in order to reinstall the CPU and HSF on a new motherboard. Liquid Pro and Liquid Ultra are definitely labor intensive in my experience, but the results are hard to argue.

 

[Stu @ MSD]

Thanks guys. I didnt bother re securing the IHS. After 48 hrs it should be welded in place anyway. And its not like it moves about.

After some tests and benching, my best overall settings with 100% stability are 45x103 for 4640mhz @ 1.27v with ram at 2200 with 1.55v.
I have also brought PLL voltage down to 1.7 for less heat.
So I have done some IBT tests set to max, with extreme ticked for ten runs using all the ram.

Results are very impressive. A max of 54C.

But perhaps even more impressive are the results of my same tests PASSIVE with no radiator cooling at all.
(All cooling fans switched off except the 2x silent case fans to keep the Vregs cool.)

Still a max of 67C. Well happy.