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3.825Ghz 775 quad

I see. So you just put a huge washer under the X bolt-through and what does this do? Push the HS harder against the chip? or does it absorb some heat off the HS?
 
Those are good options. If I don't like my temps with the stock HS&F on my stock Q9650 I will take a ride tomorrow to MC and take a look, but for now, I am going to try the suggestion by Gill as I already have a lapped TRUE that I just pulled off my stock 9650

74* ambients equal:
pic
 
Do yourself a favor and DO NOT get the Core-Contact Freezer. It's a good cooler, and performs well considering the price; however, the mounting mechanism, which much more secure than stock push-pins, is a major pain in the ass to remove in a cramped space. I spent ~10-15 minutes trying to get the metal bracket off the plastic tabs so I could take it out of my P182 SE. To make matters worse, the plastic base's push pins wouldn't release, so I had to take the entire motherboard out just to get it off.

I'd stick with something that has a bolt-through kit.
 
no, just the True... I'm about to pull the trigger on another i7 - I can't seem to get 8G stable at 3.825Ghz... so instead of buying a different set of ram, i might as well dive into another system rather than putting money in dying parts...
 
Originally posted by: BlahBlahYouToo
what does "lapped" mean?
Click to expand...

This explains why and how you lap the HSF. The same principle applies to the CPU.
http://www.overclockersclub.com/guides/lapping/

The contact surface on the CPU or HSF can be flat, concave of convex. Surfaces that may look flat are not necessarily so. Even if they are 'flat' they will have minuet troughs and peaks.

The easiest way to determine if the surface is flat is to run a straight edge across the surface. If there are gaps between the surface and the straight edge as you move it across, then it is not flat. Also a mirror like surface does not necessarily equal flat.

You can have the following scenarios:

Scenario 1
HSF: Flat
CPU: Concave / Convex

Scenario 2
HSF: Concave / Convex
CPU: Flat

Scenario 3 (but they don't necessarily 'match' perfectly):
HSF: Concave / Convex
CPU: Concave / Convex

Scenario 4:
HSF: Concave / Convex
CPU: Convex / Concave

You want to maximise the contact area between the two mating surfaces, i.e:
HSF: Flat
CPU: Flat

The lapping process sorts this out, but if you lap your CPU and you remove the writing from the heatspreader YOU VOID THE WARRANTY. You can also damage the CPU or HSF if you cock up the lapping process.

In the above explanation, reference to the CPU is actually the CPU heatspreader (or IHS).

Edit: The guide I linked to; I wouldn't apply washing up liquid or water to your CPU. Apply the water to the wet and dry instead.
 
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