- Dec 25, 2013
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IEDM: TSMC, Intel and IBM 14/16nm Processeshttps://www.semiwiki.com/forum/content/4110-iedm-tsmc-intel-ibm-14-16nm-processes.htmlhttps://www.semiwiki.com/forum/content/4110-iedm-tsmc-intel-ibm-14-16nm-processes.html
Samsung and Globalfoundries Beat TSMC to FinFET What This Means For AMD, Nvidia and Intel.
It's quite pathetic, really. Here goes my rant. TL;DR in title (according to the interview, GF HVM is actually in H1, contrary to what WCCF Tech says).
Note the 2nd generation. What the deal with that? Remember how TSMC, IBM, Samsung and Global Foundries, in a desperate act to deceive people and deny Intel's momentous Research & Development prowess, together decided to skip a shrink and call it a new node, forcing Intel to educate the public -- consisting of few investors and tech enthusiasts -- that they've been shipping the, suddenly worshiped, FinFET technology since 2011 and have now started volume -- real volume, that is -- production of a second and much improved gen of FinFET innovation; accidentally called 14nm.
Now apparently, in a sudden act of disguised comeback to further mystify Intel 4 year industry leadership advantage, TSMC made a few little changes to their process and called it a day.
Just too bad many people don't realize what the numbers mean or even bother thinking about the implications of the following:
...After already being informed about...
If the delusion wasn't yet complete...
Indeed, I could not have said it any better. The marketing insanity put everyone on an equal playing field.
Everyone; not everything.
Samsung and Globalfoundries Beat TSMC to FinFET What This Means For AMD, Nvidia and Intel.
It's quite pathetic, really. Here goes my rant. TL;DR in title (according to the interview, GF HVM is actually in H1, contrary to what WCCF Tech says).
TSMC were up first. They talked about the improvements that they had made going from their 16FF to the second generation 16FF+ under the title An Enhanced 16nm CMOS Technology Featuring 2nd Generation FinFET Transistors and Advanced Cu/low-k Interconnect for Low Power and High Performance Applications. They already reported on the basic 16FF process last year so this is an update.
Note the 2nd generation. What the deal with that? Remember how TSMC, IBM, Samsung and Global Foundries, in a desperate act to deceive people and deny Intel's momentous Research & Development prowess, together decided to skip a shrink and call it a new node, forcing Intel to educate the public -- consisting of few investors and tech enthusiasts -- that they've been shipping the, suddenly worshiped, FinFET technology since 2011 and have now started volume -- real volume, that is -- production of a second and much improved gen of FinFET innovation; accidentally called 14nm.
Now apparently, in a sudden act of disguised comeback to further mystify Intel 4 year industry leadership advantage, TSMC made a few little changes to their process and called it a day.
Just too bad many people don't realize what the numbers mean or even bother thinking about the implications of the following:
They admitted that they have had yield problems, which is public knowledge. 22nm is the highest yielding process in Intel history and 14nm is now almost at the same level. It is shipping in volume.
...After already being informed about...
I'm happy that I'm not the Apple financial guy who's in charge of all the low-yielding wafers Apple buys.Ultratech said:There is anticipation of some minor ramp that were aware of in the fourth quarter. There is capacity in place currently. We have equipment that has been relegated to the 14 and 16 nanometer note, primarily 14. And so at this time we have capacity in place to take care of that need as they begin to ramp slowly. So we dont see a significant ramp in Q4 in FinFETs. We see that occurring later or in 2015 and its really hard to project when. The current anticipation is theyre all being overly optimistic as to when theyre going to solve their problems. But the yields on the major companies right now is in the 10% to 20%. And so it's not giving them much indication as to when theyll grow that problem, that area. So it appears to me right now and the problems arent really consistent in one area. They vary in the processing and possibly design.
If the delusion wasn't yet complete...
Both Globalfoundries and Samsung beat TSMC to FinFETs with their 14nm LPE and LPP nodes. Announcing that mass production has already begun. This news comes courtesy of a Digitimes interview with GLobalfoundries Senior Vice President Chuck Fox.
The cooperative effort between both companies means that 4 worldwide fabs will have full 14nm LPE and LPP manufacturing capability in 2015. With a number of those fabs already shipping 14nm products in volume. This is especially important because TSMC has only recently managed to achieve risk qualification on its 16nm FinFET+ process. With volume production scheduled for 2H 2015, putting it behind Samsung by nearly eight months.
[...]
So what does this all mean for Red, Green and Blue. Im referring to AMD, Nvidia and Intel naturally.
Intel has already began shipping small, low power 14nm products this year with high performance parts coming in the middle of next year. So the company isnt significantly ahead of the industry as it was once in terms of process nodes. Which is very exciting for the rest of the industry players. Because it puts everyone on a relatively equal playing field.
Indeed, I could not have said it any better. The marketing insanity put everyone on an equal playing field.
Everyone; not everything.
