Recent content by LordSilver

I've just applied thermal paste on a 2670QM. I'm just worried: looking at temperatures, it seems there was not noticeable improvement from stock TIM. Maybe the line method was wrong in this case where there is not such a big pressure from heatsink and the die is wider than desktop processors...

It's written on the bottom, left corner of the chart: Overclocking.Guide Since you're interested, have a look also at this roundup: Source: Play3r.net Enjoy! ;)

Thanks for posting your experience. Unfortunately I'm not going to spend all that money just for 2°C difference for now, but who knows in future. I'd like to have temperature comparisons after 3 weeks, which are more significant in my opinion, since you never know how a new TIM performs over...

Does it worth to spend 15 € for a 5.5g syringe of Thermal Grizzly Kryonaut? Probably it could be even more than 1°C difference from the Noctua NT-H1, at least 3°C I would like to hope.

I've just found this site: http://www.cr2032.co/ It seems quite good, but it lacks proper comparisons. :\

Does anyone know a site which did it? I've been interested into this since I started to read lots of complaints about battery life expectancy of also very famous brands on different shops. A large quantity of them were delivered already discharged, even where the best before was higher than...

I added pictures so you can understand the situation more clearly. And here is the motherboard with GPU and CPU dies exposed: Hope it helps.

So, should I be concerned about pump-out effect in the case of an heatsink which has a low clamping force? There is not such a great pressure as in huge desktop heatsinks.

Are those tests on bare silicon? I doubt it. It's really a pity GC-Extreme hasn't been tested in this thread. Anyway, I still have to see a proof of NT-H1 performance drop over time.

Is the NT-H1 pumping-out effect so bad in the long term? I would like to avoid replacing TIM for some years. Maybe I should get AS Céramique 2 (provided that it performs as good as/better than previous Céramique) or the above-mentioned Dow TC-5026?

For a notebook (which has both cpu and gpu dies exposed) is it better to spread the TIM manually or to put a line and let the heatsink do the job? I'm going to use NT-H1.