^ thanks for all the kind words folks,
, glad you enjoyed the thread!
Originally Posted by Magic Carpet
Do you reckon, the Ivy Bridge processors are more likely to have thermal interface issues in the course of the next 10-15 years? Or is it dry-proof?
When I scraped the original stock CPU TIM off of my IB CPU and from the underside of the IHS it very much had the consistency of one of those thermal-mat pads that get used in laptops and such.
It had every appearance of being very durable and not likely to be going anywhere anytime soon.
I even attempted to reconstitute the stock CPU TIM
so I could test it as a HSF TIM, but my efforts failed as the stuff simply was not agreeing with the notion of being soluble in IPA (and I wasn't about to try anything less human-friendly given that my two children and wife occupy the same house
Based on my experience with this stuff, I'd say (1) it has comparable thermal conductivity properties to that of NT-H1 and MX-4, (2) it is essentially a solid-pad that is not going to dry out (it is already "dried out") or get squeezed out from the so-called pump-out effect
(incidentally, IC Diamond claims it was designed for and proven to prevent the pump-out effect
, I have not verified if this is true for our application though)