^ thanks for all the kind words folks,
, glad you enjoyed the thread!
Quote:
Originally Posted by Magic Carpet
Do you reckon, the Ivy Bridge processors are more likely to have thermal interface issues in the course of the next 10-15 years? Or is it dry-proof?  |
When I scraped the original stock CPU TIM off of my IB CPU and from the underside of the IHS it very much had the consistency of one of those thermal-mat pads that get used in laptops and such.
It had every appearance of being very durable and not likely to be going anywhere anytime soon.
I even
attempted to reconstitute the stock CPU TIM so I could test it as a HSF TIM, but my efforts failed as the stuff simply was not agreeing with the notion of being soluble in IPA (and I wasn't about to try anything less human-friendly given that my two children and wife occupy the same house
)
Based on my experience with this stuff, I'd say (1) it has comparable thermal conductivity properties to that of NT-H1 and MX-4, (2) it is essentially a solid-pad that is not going to dry out (it is already "dried out") or get squeezed out from the so-called
pump-out effect.
(incidentally, IC Diamond claims it was designed for and proven to
prevent the pump-out effect, I have not verified if this is true for our application though)
on that alone! 
